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Selected M I C A02
M I C A02

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Product Overview

Features

  • Surface-mount multilayer construction
  • Designed for high-frequency operation
  • Suitable for RF and microwave circuits
  • Compact chip format for dense PCB layouts
  • Alternative to porcelain ceramic chips 

Benefits

  • Enables miniaturization of RF designs
  • Reduces cost compared to porcelain ceramic alternatives
  • Maintains performance across wide frequency ranges
  • Simplifies automated assembly with SMT compatibility
  • Enhances reliability in high-frequency environments 

Target Applications

  • Magnetic Resonance Imaging (MRI) systems
  • RF signal chains and filters
  • Microwave communication modules
  • High-frequency analog front ends
  • Impedance matching networks 

Product Documentation

Datasheets

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